Specification
General
• Broadcom BCM57416 dual-port 10Gbps controller
• Compact size low-profile standard form factor
• PCI-E 3.0 x8 (8GT/s) interface
• Dual RJ45 connectors
• TruFlow Technology
Host Interface
• PCI-E 3.0 (8GT/s)
• MCTP over SMBus
• Function level Rest (FLR) support
• Message Signal Interrupt (MSI-X)
Networking Features
• Jumbo Frames (up to 9600-byte)
• 802.3x flow control
• Link Aggregation (802.3ad)
• Virtual LANs 802.1q VLAN tagging
• Configurable Flow Acceleration
• IEEE 1588 and Time Sync
• RDMA over Converged Ethernet (RoCE)
Stateless Offload Features
• TCP, UDP, IPv4, IPv6 checksum offload
• Large Send Offload
• Receive Segment Coalescing
• TCP segmentation Offload
• Large Receive Offload
• Receive Side Scaling (RSS)
• Transmit Side Scaling (TSS)
NIC partitioning (NPAR)
• 16 Physical Functions
• QoS per partition
• Partitioning control via sideband communication
• Up to 64MAC/VLAN filter per partition
• Stateless offload configuration per partition
• VEB/VEPA support
Virtualization Features
• NetQueue, VMQueue, and Multiqueue
• Support for 128 Virtual Functions
• VXLAN
• NVGRE
• Geneve
• Edge Virtual Bridging (EVB)
Flow Processing
• Exact/Wildcard Match Flow Lookup
• VLAN insertion/deletion
• NAT/NAPT
• Mirroring
Data Center Bridging
• Priority-based flow control (PFC; IEEE 802.1Qbb)
• Enhanced transmission selection (ETS; IEEE802.1Qau)
• Quantized congestion Notification (QCN; IEEE802.1Qau)
• Data Center Bridging Capability eXchange
(DCBX; IEEE802.1Qaz)
• 8 traffic classes per port; fully DCB compliant
per 802.1Qbb
Manageability
• Network Controller Sideband Interface (NC-SI)
• Asset Management with Thermal Sensors
Power Savings
• ACPI compliant power management
• PCI Express Active State Power Management (ASPM)
• Ultra low-power mode
• Pass-through Energy Efficient Ethernet
(IEEE802.3az-2010)
Power Consumption
• Maximum power consumption: 13.1W
Operating Conditions
• Operating temperature: 0°C to 55°C (32°F to 131°F)
• Storage temperature: -40°C to 70°C (-40°F to 158°F)
• Storage humidity: 90% non-condensing relative humidity at 35°C
Physical Dimensions
• Card PCB dimensions:
14.224cm x 6.89cm (5.6in x 2.71in) (LxW)
• Height of end brackets:
standard – 12cm (4.725in), low-profile – 8cm (3.15in)
Please note that this product is sold only as part of an integrated solution with Supermicro
Server systems supporting low-profile or full-height PCI-E 3.0 x8 expansion slot