Specification
• General
- Broadcom BCM57414 dual-port 25Gbps controller
- Compact size low-profile standard form factor
- PCI-E 3.0 x8 (8GT/s, 5GT/s or 2.5GT/s) interface
- Dual SFP28 connectors
- Typical power consumption: 5.2W
• Host Interface
- PCI-E v3.0 (8GT/s)
- MCTP over SMBus
- Function Level Reset (FLR) support
- Message Signal Interrupt (MSI-X)
• Networking features
- Jumbo frames (up to 9600-Byte)
- 802.3x flow control
- Link Aggregation (802.3ad)
- Virtual LANs – 802.1q VLAN tagging
- Configurable Flow Acceleration
- IEEE 1588 and Time Sync
• Stateless Offload Features
- TCP, UDP, IPv4, IPv6 checksum offload
- Large Send Offload
- Receive Segment Coalescing
- TCP segmentation Offload
- Large Receive Offload
- Receive Side Scaling (RSS)
- Transmit Side Scaling (TSS)
• NIC Partitioning (NPAR)
- 16 Physical Functions
- QoS per partition
- Partitioning control via sideband communication
- Up to 64 MAC/VLAN filter per partition
- Per partition statistics support
- Stateless offloads configuration per partition
- VEB/VEPA support
• Virtualization Features
- NetQueue, VMQueue, and Multiqueue
- Support for 128 Virtual Functions
- VXLAN
- NVGRE
- Geneve
- Edge Virtual Bridging (EVB)
• Flow Processing
- Exact/Wildcard Match Flow Lookup
- VLAN insertion/deletion
- NAT/NAPT
- Mirroring
• Data Center Bridging
- Priority-based flow control (PFC; IEEE 802.1Qbb)
- Enhanced transmission selection (ETS; IEEE802.1Qau)
- Quantized congestion Notification (QCN; IEEE802.1Qau)
- Data Center Bridging Capability eXchange (DCBX;
IEEE802.1Qaz)
- 8 traffic classes per port; fully DCB compliant per 802.1Qbb
• Manageability
- Network Controller Sideband Interface (NC-SI)
- PXE v2.1 remote boot
- Asset Management with Thermal Sensors
• Power Savings
- ACPI compliant power management
- PCI Express Active State Power Management (ASPM)
- Ultra low-power mode
- Pass-through Energy Efficient Ethernet (IEEE802.3az-2010)
• Operating Conditions
- Operating temperature: 0°C to 55°C (32°F to 131°F)
- Storage temperature: -40°C to 70°C (-40°F to 158°F)
- Storage humidity: 90% non-condensing relative humidity at 35°C
• Physical Dimensions
- Card PCB dimensions: 14.224cm x 6.89cm (5.6in x 2.71in)
(LxW)
- Height of end brackets: standard – 12cm (4.725in), low-profile
– 8cm (3.15in)
• Weight
- 90.5g (0.2lb)