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Máy Chủ Intel Compute Module HNS7200APRL
- Nhà sản xuất: Intel
- Mã sản phẩm/Part No. TM6817 / HNS7200APRL
- Tình trạng: Liên hệ đặt hàng
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Thông tin sản phẩm Máy Chủ Intel Compute Module HNS7200APRL
Key Feature
- Supporting bootable Intel® Xeon Phi™ product family
- Supports Intel® Omni-Path Fabric via integrated silicon (-F processor) or PCIe*-based Add-In-Card
- Intel® Omni-Path Port Upgrade Kit (2 Port) AXX2PFABKIT required for Intel® Xeon Phi™ product family -F processor
- Up to six DDR4-2400 Registered ECC memory modules (RDIMM/LRDIMM), maximum 384 GB capacity
- Two PCIe* Gen 3 x16 low-profile slots, two USB 3.0 ports, four SATA Ports and mSATA port connector
- Dual 1 GbE Base-T ports for network and manageability
- Compatible with 2U, 4 node Intel® Server Chassis with dual 2130 W power supplies
Specification
| Essentials | |
| Status | Launched |
| Launch Date | Q1'18 |
| Expected Discontinuance | Q4'21 |
| Limited 3-year Warranty | Yes |
| Extended Warranty Available for Purchase (Select Countries) | No |
| Compatible Product Series | Intel® Xeon Phi™ Processor 7200 Series |
| Board Form Factor | Custom 6.8" x 14.2" |
| Chassis Form Factor | 2U Rack |
| Socket | LGA 3647-1 |
| Integrated BMC with IPMI | Emulex Pilot III controller |
| Rack-Friendly Board | Yes |
| TDP | 320 W |
| Included Items | (1) – Intel Server Board S7200APR (3) – System fans (1) – Slot 1 Riser Card (1) – Slot 2 Riser Card (1) – I/O Bridge Board (1) – Power Docking Board (1) – 130mm 2x7 Fan Assembly Cable (1) – 140mm 2x3 Internal Power Cable (1) – Air Duct (1) – Plastic Cover (1) – Liquid Assisted Air Cooling Unit |
| Recommended Customer Price | N/A |
| Board Chipset | Intel® C612 Chipset |
| Target Market | High Performance Computing |
| Supplemental Information | |
| Embedded Options Available | No |
| Description | Intel® Server S7200APR Product Family provides parallelized workflows in the HPC market, featuring features support for Intel® Xeon® Phi™ processors, with 6 DIMMs (1DPC) and optional support for Intel® Omni Path® Fabric Technology.Liquid air cooled node. |
| Additional Information URL | Link |
| Memory Specifications | |
| Max Memory Size (dependent on memory type) | 384 GB |
| Memory Types | Registered DDR4 (RDIMM) and Load Reduced DDR4 (LRDIMM) |
| Max # of Memory Channels | 6 |
| Max Memory Bandwidth | 512 GB/s |
| Max # of DIMMs | 6 |
| ECC Memory Supported ‡ | Yes |
| Processor Graphics | |
| Integrated Graphics ‡ | Yes |
| Graphics Output | Internal RGB Video Header |
| Expansion Options | |
| PCI Express Revision | 3.0 |
| Max # of PCI Express Lanes | 32 |
| PCIe x16 Gen 3 | 2 |
| Riser Slot 1: Total # of Lanes | 16 |
| Riser Slot 2: Total # of Lanes | 16 |
| I/O Specifications | |
| # of USB Ports | 2 |
| USB Revision | 3.0 |
| Total # of SATA Ports | 1 |
| RAID Configuration | Intel(R) Embedded Server RAID Technology (ESRT2) |
| # of Serial Ports | 1 |
| Integrated LAN | 2) RJ-45 1Gb NIC ports |
| Package Specifications | |
| Max CPU Configuration | 1 |
| Advanced Technologies | |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No |
| Intel® Remote Management Module Support | Yes |
| Intel® Node Manager | Yes |
| Intel® Quick Resume Technology | Yes |
| Intel® Quiet System Technology | Yes |
| Intel® Rapid Storage Technology enterprise | Yes |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
| Intel® I/O Acceleration Technology | Yes |
| Intel® Advanced Management Technology | Yes |
| Intel® Server Customization Technology | Yes |
| Intel® Build Assurance Technology | Yes |
| Intel® Efficient Power Technology | Yes |
| Intel® Quiet Thermal Technology | Yes |
| TPM Version | 2.0 |
| Security & Reliability | |
| Intel® AES New Instructions | Yes |
| Intel® Trusted Execution Technology ‡ | Yes |
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Cấp ngày: 29/03/2017
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