Item

Specification

Computing

2 x 3rd generation Intel® Xeon®Ice Lake SP series

(each processor up to 40 cores and maximum 270W power consumption)

Memory

32 x DDR4 DIMM slots , maximum 12.0 TB

Up to 3200 MT/s data transfer rate，support RDIMM or LRDIMM

Up to 16 Intel® Optane™ DC Persistent Memory Module PMem 200 series (Barlow Pass)

Storage controller

Embedded RAID controller (SATA RAID 0, 1, 5, and 10)

Standard PCIe HBA cards and storage controllers，depending on model

Storage

Up to Front 4LFF bays, Rear 2SFF bays*

Up to Front 10SFF bays, Rear 2SFF bays*

Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2 NVMe Drives

PCIe NVMe storage accelerator, SATA/PCIe M.2 SSDs，2 x SD card kit , depending on model

Network

1 x onboard 1 Gbps management network port

1 x OCP 3.0 slot for 4 x 1GE or 2 x 10GE or 2 x 25GE NIC

PCIe Standard slots for 1/10/25/40/100GE/IB Ethernet adapter

PCIe slots

4 x PCIe 4.0 standard slots

GPU

4 x single-slot wide GPU modules

Management

HDM OOB system (with dedicated management port) and H3C iFIST/FIST, support LCD touchable smart model

U-Center unified management platform, optional

Security

Intelligent Front Security Bezel

Chassis Intrusion Detection

TPM2.0

Silicon Root of Trust

Two-factor authorization logging

Power supply

2 x Platinum 550W/800W/850W/1300W/1600W (1+1 redundancy) ,

depending on model Titanium AC power supply, optional

800W–48V/336V DC power supply (1+1 Redundancy) Hot swappable redundant fans

Operating

temperature

5°C to 45°C (41°F to 113°F)

Dimensions

1U Height