1. Dual
Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM††
3. 4 PCI-E 3.0 x16 (double-width) slots,
2 PCI-E 3.0 x16 (single-width) slots,
1 PCI-E 3.0 x4 (in x8) slot,
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
4. 8 Hot-swap 3.5" drive bays
5. 2x 10GBase-T LAN ports via Intel X550
6. 1 VGA, 2 COM, 5 USB 3.0
7. 4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control
8. 2200W Redundant Power Supplies Titanium Level (96%)
9.
GPU Kit for passive GPU/Coprocessor support (MCP-320-74702-0N-KIT)